HEF4016BDF vs MC14016BCL feature comparison

HEF4016BDF NXP Semiconductors

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MC14016BCL Motorola Semiconductor Products

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA INC
Part Package Code DIP
Package Description DIP, DIP,
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature 5V NOMINAL ALSO AVAILABLE
Analog IC - Other Type SPST SPST
JESD-30 Code R-GDIP-T14 R-GDIP-T14
Neg Supply Voltage-Nom (Vsup) -7.5 V
Number of Channels 1 1
Number of Functions 4 4
Number of Terminals 14 14
Off-state Isolation-Nom 50 dB
On-state Resistance Match-Nom 10 Ω 10 Ω
On-state Resistance-Max (Ron) 350 Ω 400 Ω
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 5.08 mm
Supply Voltage-Nom (Vsup) 15 V 7.5 V
Surface Mount NO NO
Switch-off Time-Max 100 ns 35 ns
Switch-on Time-Max 30 ns 35 ns
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 3
Rohs Code No
JESD-609 Code e0
Length 19.495 mm
Terminal Finish TIN LEAD

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