HEF4013BDB vs TC4013BP feature comparison

HEF4013BDB NXP Semiconductors

Buy Now Datasheet

TC4013BP Toshiba America Electronic Components

Buy Now Datasheet
Part Life Cycle Code Obsolete Active
Ihs Manufacturer NXP SEMICONDUCTORS TOSHIBA CORP
Part Package Code DIP DIP
Package Description DIP, 0.300 INCH, 2.54 MM PITCH, PLASTIC, DIP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 220 ns 300 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.45 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 7 MHz 12 MHz
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Samacsys Manufacturer Toshiba
Length 19.25 mm
Max Frequency@Nom-Sup 3500000 Hz
Max I(ol) 0.012 A
Package Equivalence Code DIP14,.3
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 0.12 mA
Prop. Delay@Nom-Sup 300 ns
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare HEF4013BDB with alternatives

Compare TC4013BP with alternatives