HEF4011UBT
vs
MC14011UBDR2G
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
NXP SEMICONDUCTORS
ONSEMI
Part Package Code
SOIC
SOIC-14 NB
Package Description
SOP, SOP14,.25
SOIC-14
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
JESD-609 Code
e4
e3
Length
8.65 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NAND GATE
NAND GATE
Max I(ol)
0.00035999999999999997 A
Moisture Sensitivity Level
1
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Equivalence Code
SOP14,.25
SOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
120 ns
180 ns
Propagation Delay (tpd)
120 ns
180 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
3.9 mm
3.9 mm
Base Number Matches
6
1
Manufacturer Package Code
751A-03
Samacsys Manufacturer
onsemi
Packing Method
TR
Compare HEF4011UBT with alternatives
Compare MC14011UBDR2G with alternatives