HEF4011BP
vs
5962R9662104VCC
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Transferred
|
Obsolete
|
Ihs Manufacturer |
PHILIPS SEMICONDUCTORS
|
INTERSIL CORP
|
Package Description |
DIP-14
|
DIP, DIP14,.3
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
JESD-30 Code |
R-PDIP-T14
|
R-CDIP-T14
|
JESD-609 Code |
e4
|
e4
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
NAND GATE
|
NAND GATE
|
Max I(ol) |
0.00035999999999999997 A
|
0.00064 A
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-55 °C
|
Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
Package Code |
DIP
|
DIP
|
Package Equivalence Code |
DIP14,.3
|
DIP14,.3
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
IN-LINE
|
Prop. Delay@Nom-Sup |
110 ns
|
338 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
NO
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
MILITARY
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
GOLD
|
Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
Terminal Pitch |
2.54 mm
|
2.54 mm
|
Terminal Position |
DUAL
|
DUAL
|
Base Number Matches |
2
|
2
|
Part Package Code |
|
DIP
|
Pin Count |
|
14
|
Family |
|
4000/14000/40000
|
Number of Functions |
|
4
|
Number of Inputs |
|
2
|
Propagation Delay (tpd) |
|
338 ns
|
Screening Level |
|
MIL-PRF-38535 Class V
|
Supply Voltage-Max (Vsup) |
|
18 V
|
Supply Voltage-Min (Vsup) |
|
3 V
|
Supply Voltage-Nom (Vsup) |
|
5 V
|
Total Dose |
|
100k Rad(Si) V
|
|
|
|
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