HEF4011BP,652 vs CD4011MN feature comparison

HEF4011BP,652 NXP Semiconductors

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CD4011MN Texas Instruments

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NATIONAL SEMICONDUCTOR CORP
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 DIP,
Pin Count 14 14
Manufacturer Package Code SOT27-1
Reach Compliance Code compliant unknown
ECCN Code EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Samacsys Manufacturer NXP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-PDIP-T14
JESD-609 Code e4
Length 19.025 mm 19.215 mm
Load Capacitance (CL) 50 pF 15 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.00035999999999999997 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Prop. Delay@Nom-Sup 110 ns
Propagation Delay (tpd) 110 ns 75 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO
Seated Height-Max 4.2 mm 5.08 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Width 7.62 mm 7.62 mm
Base Number Matches 1 1

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