HEF4007UBTD-T vs MC14007UBDR2 feature comparison

HEF4007UBTD-T NXP Semiconductors

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MC14007UBDR2 Freescale Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code SOIC
Package Description PLASTIC, SO-14 SOP, SOP14,.25
Pin Count 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
Additional Feature DUAL COMPLEMENTARY PAIR PLUS INVERTER
Family 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 8.65 mm
Load Capacitance (CL) 50 pF
Logic IC Type INVERTER
Number of Functions 3
Number of Inputs 1
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 80 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 40
Width 3.9 mm
Base Number Matches 3 5
JESD-609 Code e0
Package Equivalence Code SOP14,.25
Power Supplies 5/15 V
Terminal Finish Tin/Lead (Sn/Pb)

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