HEF4007UBP,652
vs
MC14007UBAL
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
PLASTIC, DIP-14
|
DIP, DIP14,.3
|
| Pin Count |
14
|
14
|
| Manufacturer Package Code |
SOT27-1
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
DUAL COMPLEMENTARY PAIR PLUS INVERTER
|
DUAL COMPLEMENTARY PAIR PLUS INVERTER
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| JESD-30 Code |
R-PDIP-T14
|
R-GDIP-T14
|
| JESD-609 Code |
e4
|
e0
|
| Length |
19.025 mm
|
19.495 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
INVERTER
|
INVERTER
|
| Number of Functions |
3
|
3
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
|
| Propagation Delay (tpd) |
80 ns
|
125 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
4.2 mm
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
18 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
TIN LEAD
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
3
|
| Pbfree Code |
|
No
|
| Package Equivalence Code |
|
DIP14,.3
|
|
|
|
Compare HEF4007UBP,652 with alternatives
Compare MC14007UBAL with alternatives