HEF4007UBP,652 vs CD4007UBDMSH feature comparison

HEF4007UBP,652 NXP Semiconductors

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CD4007UBDMSH Harris Semiconductor

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Rohs Code Yes No
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Part Package Code DIP
Package Description PLASTIC, DIP-14 DIP, DIP14,.3
Pin Count 14
Manufacturer Package Code SOT27-1
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature DUAL COMPLEMENTARY PAIR PLUS INVERTER DUAL COMPLEMENTARY PAIR PLUS INVERTER; OPEN SOURCE/DRAIN O/PS FROM COMPLEMENTARY PAIR
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-PDIP-T14 R-CDIP-T14
JESD-609 Code e4 e0
Length 19.025 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type INVERTER INVERTER
Number of Functions 3 3
Number of Inputs 1 1
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, METAL-SEALED COFIRED
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Propagation Delay (tpd) 80 ns 149 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 4.2 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Tin/Lead (Sn/Pb)
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm
Base Number Matches 1 1
Package Equivalence Code DIP14,.3
Screening Level 38535V;38534K;883S

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