HEF4002BP
vs
5962-01-241-7364
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Contact Manufacturer
Ihs Manufacturer
PHILIPS SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
DIP-14
DIP, DIP14,.3
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
JESD-30 Code
R-PDIP-T14
R-PDIP-T14
JESD-609 Code
e4
e3
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NOR GATE
AND GATE
Max I(ol)
0.00035999999999999997 A
0.00035999999999999997 A
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Prop. Delay@Nom-Sup
120 ns
120 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
MATTE TIN
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Base Number Matches
2
1
Pbfree Code
Moisture Sensitivity Level
1
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