HEF4001UBTD-T
vs
CD4001UBM96E4
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
TEXAS INSTRUMENTS INC
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP14,.25
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
8.65 mm
8.65 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
NOR GATE
NOR GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
130 ns
120 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
15 V
18 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
3.9 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
JESD-609 Code
e4
Moisture Sensitivity Level
1
Package Equivalence Code
SOP14,.25
Packing Method
TR
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
120 ns
Schmitt Trigger
NO
Terminal Finish
NICKEL PALLADIUM GOLD
Time@Peak Reflow Temperature-Max (s)
30
Compare HEF4001UBTD-T with alternatives
Compare CD4001UBM96E4 with alternatives