HEF4001BTD vs CD4001BCM feature comparison

HEF4001BTD Philips Semiconductors

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CD4001BCM Rochester Electronics LLC

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Active
Ihs Manufacturer PHILIPS SEMICONDUCTORS ROCHESTER ELECTRONICS INC
Package Description SOP, SOP14,.25 SOP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e4 e3
Load Capacitance (CL) 50 pF
Logic IC Type NOR GATE NOR GATE
Max I(ol) 0.00035999999999999997 A
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Prop. Delay@Nom-Sup 120 ns
Qualification Status Not Qualified COMMERCIAL
Schmitt Trigger NO
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) MATTE TIN
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Base Number Matches 2 4
Pbfree Code Yes
Part Package Code SOIC
Pin Count 14
Family 4000/14000/40000
Length 8.65 mm
Moisture Sensitivity Level 1
Number of Functions 4
Number of Inputs 2
Peak Reflow Temperature (Cel) 260
Propagation Delay (tpd) 250 ns
Seated Height-Max 1.75 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 3.9 mm