HEF4001BPN
vs
933372580653
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
Part Package Code |
DIP
|
SOIC
|
Package Description |
DIP, DIP14,.3
|
SOP,
|
Pin Count |
14
|
14
|
Reach Compliance Code |
unknown
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Samacsys Manufacturer |
NXP
|
|
Family |
4000/14000/40000
|
4000/14000/40000
|
JESD-30 Code |
R-PDIP-T14
|
R-PDSO-G14
|
JESD-609 Code |
e4
|
e4
|
Length |
19.025 mm
|
8.65 mm
|
Load Capacitance (CL) |
50 pF
|
|
Logic IC Type |
NOR GATE
|
NOR GATE
|
Max I(ol) |
0.00035999999999999997 A
|
|
Number of Functions |
4
|
2
|
Number of Inputs |
2
|
3
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
DIP
|
SOP
|
Package Equivalence Code |
DIP14,.3
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
IN-LINE
|
SMALL OUTLINE
|
Prop. Delay@Nom-Sup |
120 ns
|
|
Propagation Delay (tpd) |
120 ns
|
140 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Schmitt Trigger |
NO
|
|
Seated Height-Max |
4.2 mm
|
1.75 mm
|
Supply Voltage-Max (Vsup) |
15 V
|
15 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
NICKEL PALLADIUM GOLD
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Terminal Form |
THROUGH-HOLE
|
GULL WING
|
Terminal Pitch |
2.54 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Width |
7.62 mm
|
3.9 mm
|
Base Number Matches |
1
|
1
|
Pbfree Code |
|
Yes
|
Additional Feature |
|
MIXED WITH 1 INVERTER
|
Moisture Sensitivity Level |
|
1
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare HEF4001BPN with alternatives
Compare 933372580653 with alternatives