HEC4511BD
vs
HEF4511BP
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
NXP SEMICONDUCTORS
|
NXP SEMICONDUCTORS
|
| Package Description |
DIP,
|
DIP,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
BLANKING INPUT; LAMP TEST INPUT; LED DISPLAY DRIVER; IOH = 10MA @ VOH = 3.2V
|
BLANKING INPUT; LAMP TEST INPUT; LED DISPLAY DRIVER; IOH = 20MA @ VOH = 2.5V
|
| Family |
4000/14000/40000
|
4000/14000/40000
|
| Input Conditioning |
LATCHED
|
LATCHED
|
| JESD-30 Code |
R-CDIP-T16
|
R-PDIP-T16
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
SEVEN SEGMENT DECODER/DRIVER
|
SEVEN SEGMENT DECODER/DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
125 °C
|
125 °C
|
| Operating Temperature-Min |
-55 °C
|
-40 °C
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
CERAMIC, METAL-SEALED COFIRED
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Propagation Delay (tpd) |
310 ns
|
310 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
4.7 mm
|
| Supply Voltage-Max (Vsup) |
15 V
|
15 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
MILITARY
|
AUTOMOTIVE
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
2
|
4
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
DIP
|
| Pin Count |
|
16
|
| Samacsys Manufacturer |
|
NXP
|
| JESD-609 Code |
|
e4
|
| Length |
|
21.6 mm
|
| Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare HEC4511BD with alternatives
Compare HEF4511BP with alternatives