HEC4094BDB vs HEF4094BPN feature comparison

HEC4094BDB NXP Semiconductors

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HEF4094BPN NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, DIP, DIP16,.3
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature PARALLEL OUTPUT IS LATCHED; UNLATCHED SERIAL SHIFT RIGHT OUTPUT PARALLEL OUTPUT IS LATCHED; UNLATCHED SERIAL SHIFT RIGHT OUTPUT
Count Direction RIGHT RIGHT
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type SERIAL IN PARALLEL OUT SERIAL IN PARALLEL OUT
Number of Bits 8 8
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C 85 °C
Operating Temperature-Min -55 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 330 ns 330 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.7 mm
Supply Voltage-Max (Vsup) 15 V 15 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY INDUSTRIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 5 MHz 5 MHz
Base Number Matches 1 1
Rohs Code Yes
Part Package Code DIP
Pin Count 16
Samacsys Manufacturer NXP
Length 21.6 mm
Package Equivalence Code DIP16,.3
Peak Reflow Temperature (Cel) 245
Time@Peak Reflow Temperature-Max (s) 40

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