HEC4040BDB
vs
HEF4040BP,652
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
NXP SEMICONDUCTORS
NXP SEMICONDUCTORS
Package Description
DIP,
PLASTIC, SOT-38-1, DIP-16
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Count Direction
UP
UP
Family
4000/14000/40000
4000/14000/40000
JESD-30 Code
R-GDIP-T16
R-PDIP-T16
Load Capacitance (CL)
50 pF
50 pF
Load/Preset Input
YES
NO
Logic IC Type
BINARY COUNTER
BINARY COUNTER
Mode of Operation
ASYNCHRONOUS
ASYNCHRONOUS
Number of Bits
12
12
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
125 °C
85 °C
Operating Temperature-Min
-55 °C
-40 °C
Package Body Material
CERAMIC, GLASS-SEALED
PLASTIC/EPOXY
Package Code
DIP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Propagation Delay (tpd)
210 ns
210 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.08 mm
4.7 mm
Supply Voltage-Max (Vsup)
15 V
15 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
MILITARY
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
Width
7.62 mm
7.62 mm
fmax-Min
10 MHz
50 MHz
Base Number Matches
1
1
Rohs Code
Part Package Code
DIP
Pin Count
16
Manufacturer Package Code
SOT38-4
Factory Lead Time
4 Weeks
Samacsys Manufacturer
NXP
JESD-609 Code
e4
Length
21.6 mm
Max Frequency@Nom-Sup
10000000 Hz
Package Equivalence Code
DIP16,.3
Packing Method
BULK
Terminal Finish
NICKEL PALLADIUM GOLD
Compare HEC4040BDB with alternatives
Compare HEF4040BP,652 with alternatives