HEC4024BDB vs CD4024BFMS feature comparison

HEC4024BDB NXP Semiconductors

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CD4024BFMS Intersil Corporation

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS HARRIS SEMICONDUCTOR
Package Description DIP, ,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Count Direction UP UP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T14 R-PDIP-T14
Load Capacitance (CL) 50 pF 50 pF
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Number of Bits 7 7
Number of Functions 1 1
Number of Terminals 14 14
Operating Temperature-Max 125 °C 125 °C
Operating Temperature-Min -55 °C -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 200 ns 486 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm
Supply Voltage-Max (Vsup) 15 V 18 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 7.62 mm
fmax-Min 5 MHz 12 MHz
Base Number Matches 1 3

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