HEC4020BDB vs 933282710652 feature comparison

HEC4020BDB NXP Semiconductors

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933282710652 NXP Semiconductors

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer NXP SEMICONDUCTORS NXP SEMICONDUCTORS
Package Description DIP, DIP,
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature OUTPUTS FROM 12 STAGES AVAILABLE
Count Direction UP UP
Family 4000/14000/40000 4000/14000/40000
JESD-30 Code R-GDIP-T16 R-PDIP-T16
Load Capacitance (CL) 50 pF
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Number of Bits 14 14
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, GLASS-SEALED PLASTIC/EPOXY
Package Code DIP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Propagation Delay (tpd) 210 ns 210 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.08 mm 4.7 mm
Supply Voltage-Max (Vsup) 15 V
Supply Voltage-Min (Vsup) 3 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade MILITARY
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 7.62 mm 7.62 mm
fmax-Min 5 MHz 18 MHz
Base Number Matches 1 1
Pbfree Code Yes
Rohs Code Yes
Part Package Code DIP
Pin Count 16
JESD-609 Code e4
Length 21.6 mm
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare HEC4020BDB with alternatives

Compare 933282710652 with alternatives