HD74LVC74FP vs TC74LCX74F(ELP) feature comparison

HD74LVC74FP Renesas Electronics Corporation

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TC74LCX74F(ELP) Toshiba America Electronic Components

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Pbfree Code No No
Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP14,.25 SOP,
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G14 R-PDSO-G14
JESD-609 Code e0
Length 10.06 mm 10.3 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 150000000 Hz
Max I(ol) 0.024 A
Moisture Sensitivity Level 1
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 NOT SPECIFIED
Prop. Delay@Nom-Sup 8 ns
Propagation Delay (tpd) 9 ns 7 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 1.9 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20 NOT SPECIFIED
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 5.5 mm 5.3 mm
fmax-Min 150 MHz 150 MHz
Base Number Matches 2 1

Compare HD74LVC74FP with alternatives

Compare TC74LCX74F(ELP) with alternatives