HD74LVC74FP
vs
TC74LCX74F(ELP)
feature comparison
Pbfree Code |
No
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Obsolete
|
Active
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
TOSHIBA CORP
|
Part Package Code |
SOIC
|
SOIC
|
Package Description |
SOP, SOP14,.25
|
SOP,
|
Pin Count |
14
|
14
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
LVC/LCX/Z
|
LVC/LCX/Z
|
JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
JESD-609 Code |
e0
|
|
Length |
10.06 mm
|
10.3 mm
|
Load Capacitance (CL) |
50 pF
|
50 pF
|
Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
Max Frequency@Nom-Sup |
150000000 Hz
|
|
Max I(ol) |
0.024 A
|
|
Moisture Sensitivity Level |
1
|
|
Number of Bits |
1
|
1
|
Number of Functions |
2
|
2
|
Number of Terminals |
14
|
14
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
SOP
|
SOP
|
Package Equivalence Code |
SOP14,.25
|
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
Prop. Delay@Nom-Sup |
8 ns
|
|
Propagation Delay (tpd) |
9 ns
|
7 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.2 mm
|
1.9 mm
|
Supply Voltage-Max (Vsup) |
5.5 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2 V
|
2 V
|
Supply Voltage-Nom (Vsup) |
2.7 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
20
|
NOT SPECIFIED
|
Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
Width |
5.5 mm
|
5.3 mm
|
fmax-Min |
150 MHz
|
150 MHz
|
Base Number Matches |
2
|
1
|
|
|
|
Compare HD74LVC74FP with alternatives
Compare TC74LCX74F(ELP) with alternatives