HD74LVC573AFPEL vs MC74LCX573M feature comparison

HD74LVC573AFPEL Renesas Electronics Corporation

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MC74LCX573M Motorola Mobility LLC

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP MOTOROLA INC
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 20 20
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LVC/LCX/Z LVC/LCX/Z
JESD-30 Code R-PDSO-G20 R-PDSO-G20
Length 12.6 mm 12.575 mm
Logic IC Type BUS DRIVER BUS DRIVER
Number of Bits 8 8
Number of Functions 1 1
Number of Ports 2 2
Number of Terminals 20 20
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Characteristics 3-STATE 3-STATE
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 9.5 ns 9.5 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 2.05 mm
Supply Voltage-Max (Vsup) 5.5 V 3.6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 2.7 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 5.5 mm 5.275 mm
Base Number Matches 2 2
Additional Feature BROADSIDE VERSION OF 373
JESD-609 Code e0
Load Capacitance (CL) 50 pF
Terminal Finish Tin/Lead (Sn/Pb)

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Compare MC74LCX573M with alternatives