HD74LVC541T
vs
MC74HC541ND
feature comparison
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
TSSOP
|
|
| Package Description |
TSSOP,
|
DIP, DIP20,.3
|
| Pin Count |
20
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Additional Feature |
WITH DUAL OUTPUT ENABLE
|
|
| Family |
LVC/LCX/Z
|
|
| JESD-30 Code |
R-PDSO-G20
|
R-PDIP-T20
|
| Length |
6.5 mm
|
|
| Logic IC Type |
BUS DRIVER
|
BUS DRIVER
|
| Number of Bits |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Ports |
2
|
|
| Number of Terminals |
20
|
20
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
DIP
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
IN-LINE
|
| Propagation Delay (tpd) |
8 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Surface Mount |
YES
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
0.65 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
4.4 mm
|
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
No
|
| Control Type |
|
ENABLE LOW
|
| JESD-609 Code |
|
e0
|
| Max I(ol) |
|
0.006 A
|
| Package Equivalence Code |
|
DIP20,.3
|
| Power Supplies |
|
2/6 V
|
| Terminal Finish |
|
Tin/Lead (Sn/Pb)
|
|
|
|
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