HD74LVC540T
vs
TC74LCX540FELP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
RENESAS ELECTRONICS CORP
TOSHIBA CORP
Part Package Code
TSSOP
SOIC
Package Description
TSSOP,
0.300 INCH, EIAJ TYPE2, PLASTIC, SOP-20
Pin Count
20
20
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
Additional Feature
WITH DUAL OUTPUT ENABLE
WITH DUAL OUTPUT ENABLE
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
Length
6.5 mm
12.8 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE
Propagation Delay (tpd)
9 ns
6.5 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
1.8 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
5.3 mm
Base Number Matches
1
2
Pbfree Code
No
Rohs Code
No
JESD-609 Code
e0
Load Capacitance (CL)
50 pF
Peak Reflow Temperature (Cel)
240
Terminal Finish
TIN LEAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD74LVC540T with alternatives
Compare TC74LCX540FELP with alternatives