HD74LVC32TELL
vs
MC74LCX32DT
feature comparison
All Stats
Differences Only
Pbfree Code
No
Rohs Code
Yes
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
ONSEMI
Part Package Code
TSSOP
TSSOP
Package Description
TSSOP, TSSOP14,.25
LEAD FREE, TSSOP-14
Pin Count
14
14
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
5 mm
5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
OR GATE
OR GATE
Max I(ol)
0.024 A
0.024 A
Moisture Sensitivity Level
1
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP14,.25
TSSOP14,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method
TR
RAIL
Peak Reflow Temperature (Cel)
260
260
Prop. Delay@Nom-Sup
6 ns
5.5 ns
Propagation Delay (tpd)
7 ns
6.6 ns
Qualification Status
Not Qualified
Not Qualified
Schmitt Trigger
NO
NO
Seated Height-Max
1.1 mm
1.2 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
4.4 mm
4.4 mm
Base Number Matches
1
5
Factory Lead Time
4 Weeks
Samacsys Manufacturer
onsemi
JESD-609 Code
e4
Terminal Finish
NICKEL PALLADIUM GOLD
Compare HD74LVC32TELL with alternatives
Compare MC74LCX32DT with alternatives