HD74LVC138TELL-E
vs
74LVC138APW
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS ELECTRONICS CORP
PHILIPS SEMICONDUCTORS
Part Package Code
TSSOP
Package Description
TSSOP,
Pin Count
16
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
Input Conditioning
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
5 mm
Logic IC Type
3-LINE TO 8-LINE DECODER
3-LINE TO 8-LINE DECODER
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd)
10 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
Base Number Matches
1
3
Rohs Code
Max I(ol)
0.024 A
Package Equivalence Code
TSSOP16,.25
Packing Method
TUBE
Peak Reflow Temperature (Cel)
260
Prop. Delay@Nom-Sup
7.5 ns
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