HD74LVC00RP
vs
TC74LCX00F
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP, SOP14,.3
Pin Count
14
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LVC/LCX/Z
LVC/LCX/Z
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
8.65 mm
10.3 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
4
Number of Inputs
2
2
Number of Terminals
14
14
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
7 ns
6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.9 mm
Supply Voltage-Max (Vsup)
5.5 V
3.6 V
Supply Voltage-Min (Vsup)
2 V
2 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
5.3 mm
Base Number Matches
2
1
Pbfree Code
Yes
Rohs Code
Yes
Samacsys Manufacturer
Toshiba
Load Capacitance (CL)
50 pF
Max I(ol)
0.024 A
Package Equivalence Code
SOP14,.3
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Prop. Delay@Nom-Sup
6 ns
Schmitt Trigger
NO
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD74LVC00RP with alternatives
Compare TC74LCX00F with alternatives