HD74LV74AT
vs
74LV74PW-T
feature comparison
| Part Life Cycle Code |
Transferred
|
Transferred
|
| Ihs Manufacturer |
HITACHI LTD
|
PHILIPS SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
|
| Package Description |
TSSOP, TSSOP14,.25
|
TSSOP, TSSOP14,.25
|
| Pin Count |
14
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LV/LV-A/LVX/H
|
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
5 mm
|
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
25000000 Hz
|
48000000 Hz
|
| Max I(ol) |
0.006 A
|
0.012 A
|
| Number of Bits |
1
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP14,.25
|
TSSOP14,.25
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Prop. Delay@Nom-Sup |
23 ns
|
33 ns
|
| Propagation Delay (tpd) |
23 ns
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
|
| Supply Voltage-Min (Vsup) |
2 V
|
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.635 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
4.4 mm
|
|
| fmax-Min |
110 MHz
|
|
| Base Number Matches |
2
|
3
|
| Rohs Code |
|
Yes
|
| Moisture Sensitivity Level |
|
1
|
| Packing Method |
|
TR
|
| Peak Reflow Temperature (Cel) |
|
260
|
|
|
|
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