HD74LV574AT
vs
74LV574PW-T
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
HITACHI LTD
PHILIPS SEMICONDUCTORS
Part Package Code
TSSOP
Package Description
TSSOP, TSSOP20,.25
TSSOP, TSSOP20,.25
Pin Count
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G20
R-PDSO-G20
JESD-609 Code
e0
Length
6.5 mm
Load Capacitance (CL)
50 pF
50 pF
Logic IC Type
BUS DRIVER
D FLIP-FLOP
Max Frequency@Nom-Sup
45000000 Hz
20000000 Hz
Max I(ol)
0.008 A
0.008 A
Number of Bits
8
Number of Functions
1
8
Number of Terminals
20
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
TSSOP
Package Equivalence Code
TSSOP20,.25
TSSOP20,.25
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Prop. Delay@Nom-Sup
19 ns
25 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Finish
Tin/Lead (Sn/Pb)
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.635 mm
Terminal Position
DUAL
DUAL
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
4.4 mm
Base Number Matches
2
2
Packing Method
TR
Peak Reflow Temperature (Cel)
260
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