HD74LV157ATELL vs TC7WH157FU feature comparison

HD74LV157ATELL Renesas Electronics Corporation

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TC7WH157FU Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes Yes
Part Life Cycle Code Active Active
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code TSSOP SOIC
Package Description TSSOP, TSSOP16,.25 LSSOP, TSSOP8,.16
Pin Count 16 8
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LV/LV-A/LVX/H HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G8
Length 5 mm 2.9 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type MULTIPLEXER MULTIPLEXER
Max I(ol) 0.006 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 4 1
Number of Inputs 2 2
Number of Outputs 1 1
Number of Terminals 16 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity TRUE COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP LSSOP
Package Equivalence Code TSSOP16,.25 TSSOP8,.16
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, LOW PROFILE, SHRINK PITCH
Packing Method TR
Prop. Delay@Nom-Sup 15 ns 15 ns
Propagation Delay (tpd) 22 ns 15 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.3 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 2.8 mm
Base Number Matches 3 6
Samacsys Manufacturer Toshiba
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30

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