HD74LV157AT-ELL
vs
74LVX157MTC
feature comparison
Pbfree Code |
Yes
|
Yes
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
FAIRCHILD SEMICONDUCTOR CORP
|
Part Package Code |
SOIC
|
TSSOP
|
Package Description |
TSSOP,
|
4.40 MM, MO-153, TSSOP-16
|
Pin Count |
16
|
16
|
Reach Compliance Code |
compliant
|
compliant
|
Family |
LV/LV-A/LVX/H
|
LV/LV-A/LVX/H
|
JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
Length |
5 mm
|
5 mm
|
Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
Moisture Sensitivity Level |
1
|
1
|
Number of Terminals |
16
|
16
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
1.1 mm
|
1.2 mm
|
Surface Mount |
YES
|
YES
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
30
|
Width |
4.4 mm
|
4.4 mm
|
Base Number Matches |
2
|
4
|
Manufacturer Package Code |
|
16 LD,TSSOP,JEDEC MO-153, 4.4MM WIDE
|
ECCN Code |
|
EAR99
|
HTS Code |
|
8542.39.00.01
|
JESD-609 Code |
|
e4
|
Load Capacitance (CL) |
|
50 pF
|
Max I(ol) |
|
0.004 A
|
Number of Functions |
|
4
|
Number of Inputs |
|
2
|
Number of Outputs |
|
1
|
Operating Temperature-Max |
|
85 °C
|
Operating Temperature-Min |
|
-40 °C
|
Output Polarity |
|
TRUE
|
Package Equivalence Code |
|
TSSOP16,.25
|
Prop. Delay@Nom-Sup |
|
13 ns
|
Propagation Delay (tpd) |
|
19 ns
|
Supply Voltage-Max (Vsup) |
|
3.6 V
|
Supply Voltage-Min (Vsup) |
|
2 V
|
Supply Voltage-Nom (Vsup) |
|
2.7 V
|
Technology |
|
CMOS
|
Temperature Grade |
|
INDUSTRIAL
|
Terminal Finish |
|
NICKEL PALLADIUM GOLD
|
|
|
|
Compare HD74LV157AT-ELL with alternatives
Compare 74LVX157MTC with alternatives