HD74LV123ARP
vs
935210250112
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
RENESAS TECHNOLOGY CORP
NXP SEMICONDUCTORS
Part Package Code
SOIC
SOIC
Package Description
SOP,
3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16
Pin Count
16
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LV/LV-A/LVX/H
LV/LV-A/LVX/H
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
9.9 mm
9.9 mm
Logic IC Type
MONOSTABLE MULTIVIBRATOR
MONOSTABLE MULTIVIBRATOR
Number of Data/Clock Inputs
2
2
Number of Functions
2
2
Number of Terminals
16
16
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
42 ns
92 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
1.75 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
1 V
Supply Voltage-Nom (Vsup)
2.5 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
AUTOMOTIVE
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.95 mm
3.9 mm
Base Number Matches
2
2
Pbfree Code
Rohs Code
JESD-609 Code
e4
Moisture Sensitivity Level
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Terminal Finish
Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD74LV123ARP with alternatives
Compare 935210250112 with alternatives