HD74LV123ARP vs 935210250112 feature comparison

HD74LV123ARP Renesas Electronics Corporation

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935210250112 NXP Semiconductors

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer RENESAS TECHNOLOGY CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, 3.90 MM, PLASTIC, MS-012, SOT-109-1, SOP-16
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LV/LV-A/LVX/H LV/LV-A/LVX/H
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 9.9 mm 9.9 mm
Logic IC Type MONOSTABLE MULTIVIBRATOR MONOSTABLE MULTIVIBRATOR
Number of Data/Clock Inputs 2 2
Number of Functions 2 2
Number of Terminals 16 16
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 42 ns 92 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 2 V 1 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Width 3.95 mm 3.9 mm
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare HD74LV123ARP with alternatives

Compare 935210250112 with alternatives