HD74LS93RP-EL vs 933372850652 feature comparison

HD74LS93RP-EL Renesas Electronics Corporation

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933372850652 NXP Semiconductors

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Part Life Cycle Code Contact Manufacturer Transferred
Ihs Manufacturer RENESAS ELECTRONICS CORP NXP SEMICONDUCTORS
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 14 16
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature DIVIDE BY 2 AND DIVIDE BY 8 FUNCTIONS
Count Direction UP UP
Family LS 4000/14000/40000
JESD-30 Code R-PDSO-G14 R-PDSO-G16
Length 8.65 mm 9.9 mm
Load/Preset Input YES YES
Logic IC Type BINARY COUNTER BINARY COUNTER
Mode of Operation ASYNCHRONOUS ASYNCHRONOUS
Number of Bits 3 12
Number of Functions 2 1
Number of Terminals 14 16
Operating Temperature-Max 75 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 70 ns 210 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.25 V
Supply Voltage-Min (Vsup) 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 3.95 mm 3.9 mm
fmax-Min 32 MHz 25 MHz
Base Number Matches 2 2
Pbfree Code Yes
Rohs Code Yes
JESD-609 Code e4
Moisture Sensitivity Level 1
Peak Reflow Temperature (Cel) NOT SPECIFIED
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare HD74LS93RP-EL with alternatives

Compare 933372850652 with alternatives