HD74LS375RP-EL vs TC74HC273AF-TP1 feature comparison

HD74LS375RP-EL Renesas Electronics Corporation

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TC74HC273AF-TP1 Toshiba America Electronic Components

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Part Life Cycle Code Contact Manufacturer Active
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 16 20
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HC/UH
JESD-30 Code R-PDSO-G16 R-PDSO-G20
Length 9.9 mm 12.8 mm
Logic IC Type D LATCH D FLIP-FLOP
Number of Bits 2 8
Number of Functions 2 1
Number of Terminals 16 20
Operating Temperature-Max 75 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Output Polarity COMPLEMENTARY TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Propagation Delay (tpd) 27 ns 36 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.75 mm 1.8 mm
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type HIGH LEVEL POSITIVE EDGE
Width 3.95 mm 5.3 mm
Base Number Matches 1 3
Pbfree Code No
Rohs Code No
Load Capacitance (CL) 50 pF
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
fmax-Min 24 MHz

Compare HD74LS375RP-EL with alternatives

Compare TC74HC273AF-TP1 with alternatives