HD74LS375RP
vs
HD74LS75FP
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS TECHNOLOGY CORP
|
HITACHI LTD
|
| Part Package Code |
SOIC
|
SOIC
|
| Package Description |
SOP, SOP16,.25
|
SOP, SOP16,.3
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
unknown
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
LS
|
| JESD-30 Code |
R-PDSO-G16
|
R-PDSO-G16
|
| JESD-609 Code |
e0
|
|
| Length |
9.9 mm
|
10.06 mm
|
| Logic IC Type |
D LATCH
|
D LATCH
|
| Max I(ol) |
0.008 A
|
0.008 A
|
| Number of Bits |
2
|
2
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
75 °C
|
75 °C
|
| Operating Temperature-Min |
-20 °C
|
-20 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP16,.25
|
SOP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Power Supply Current-Max (ICC) |
12 mA
|
12 mA
|
| Prop. Delay@Nom-Sup |
20 ns
|
27 ns
|
| Propagation Delay (tpd) |
30 ns
|
27 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.75 mm
|
2.2 mm
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL EXTENDED
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
HIGH LEVEL
|
HIGH LEVEL
|
| Width |
3.95 mm
|
5.5 mm
|
| Base Number Matches |
2
|
2
|
| Moisture Sensitivity Level |
|
1
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Time@Peak Reflow Temperature-Max (s) |
|
20
|
|
|
|
Compare HD74LS375RP with alternatives
Compare HD74LS75FP with alternatives