HD74LS30RPEL
vs
M38510/30009BCA
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Active
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
TELEDYNE E2V (UK) LTD
|
| Part Package Code |
SOIC
|
DIP
|
| Package Description |
SOP, SOP14,.25
|
DIP, DIP14,.3
|
| Pin Count |
14
|
14
|
| Reach Compliance Code |
unknown
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
LS
|
| JESD-30 Code |
R-PDSO-G14
|
R-GDIP-T14
|
| Length |
8.65 mm
|
|
| Load Capacitance (CL) |
15 pF
|
|
| Logic IC Type |
NAND GATE
|
NAND GATE
|
| Max I(ol) |
0.008 A
|
0.004 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
1
|
1
|
| Number of Inputs |
8
|
8
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, GLASS-SEALED
|
| Package Code |
SOP
|
DIP
|
| Package Equivalence Code |
SOP14,.25
|
DIP14,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
IN-LINE
|
| Packing Method |
TR
|
|
| Power Supply Current-Max (ICC) |
1.1 mA
|
1.1 mA
|
| Prop. Delay@Nom-Sup |
20 ns
|
38 ns
|
| Propagation Delay (tpd) |
20 ns
|
38 ns
|
| Qualification Status |
Not Qualified
|
Qualified
|
| Schmitt Trigger |
NO
|
NO
|
| Seated Height-Max |
1.75 mm
|
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Form |
GULL WING
|
THROUGH-HOLE
|
| Terminal Pitch |
1.27 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
3.95 mm
|
|
| Base Number Matches |
3
|
1
|
| ECCN Code |
|
EAR99
|
| JESD-609 Code |
|
e0
|
| Screening Level |
|
38535Q/M;38534H;883B
|
| Terminal Finish |
|
TIN LEAD
|
|
|
|
Compare HD74LS30RPEL with alternatives
Compare M38510/30009BCA with alternatives