HD74LS279FP-E
vs
SN74LS279JDS
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
SOIC
Package Description
SOP,
DIP, DIP16,.3
Pin Count
16
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
LS
JESD-30 Code
R-PDSO-G16
R-XDIP-T16
Length
10.06 mm
Logic IC Type
R-S LATCH
R-S LATCH
Moisture Sensitivity Level
1
Number of Bits
2
1
Number of Functions
4
4
Number of Terminals
16
16
Operating Temperature-Max
75 °C
70 °C
Operating Temperature-Min
-20 °C
Output Polarity
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
SOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
IN-LINE
Propagation Delay (tpd)
27 ns
Qualification Status
Not Qualified
Seated Height-Max
2.2 mm
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
1.27 mm
2.54 mm
Terminal Position
DUAL
DUAL
Trigger Type
LOW LEVEL
Width
5.5 mm
Base Number Matches
1
3
JESD-609 Code
e0
Package Equivalence Code
DIP16,.3
Power Supplies
5 V
Terminal Finish
Tin/Lead (Sn/Pb)
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