HD74LS26RP-EL
vs
SN74LS26DR2
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HITACHI LTD
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
SOIC
Package Description
SOP,
SOP, SOP14,.25
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Family
LS
JESD-30 Code
R-PDSO-G14
R-PDSO-G14
Length
8.65 mm
Logic IC Type
NAND GATE
NAND GATE
Number of Functions
4
Number of Inputs
2
Number of Terminals
14
14
Operating Temperature-Max
75 °C
70 °C
Operating Temperature-Min
-20 °C
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Propagation Delay (tpd)
32 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Width
3.9 mm
Base Number Matches
2
4
Rohs Code
JESD-609 Code
e0
Max I(ol)
0.008 A
Output Characteristics
OPEN-COLLECTOR
Package Equivalence Code
SOP14,.25
Packing Method
TAPE AND REEL
Power Supplies
5 V
Power Supply Current-Max (ICC)
4.4 mA
Prop. Delay@Nom-Sup
32 ns
Schmitt Trigger
NO
Terminal Finish
Tin/Lead (Sn/Pb)
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