HD74LS248FP-EL vs TC74LVQ138FNEL feature comparison

HD74LS248FP-EL Renesas Electronics Corporation

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TC74LVQ138FNEL Toshiba America Electronic Components

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS ELECTRONICS CORP TOSHIBA CORP
Part Package Code SOIC SOIC
Package Description SOP, SOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
Family LS LVQ
Input Conditioning STANDARD
JESD-30 Code R-PDSO-G16 R-PDSO-G16
Length 10.06 mm 9.9 mm
Moisture Sensitivity Level 1
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 75 °C 85 °C
Operating Temperature-Min -20 °C -40 °C
Output Polarity TRUE INVERTED
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 260 240
Propagation Delay (tpd) 100 ns 15 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm 1.75 mm
Supply Voltage-Nom (Vsup) 5 V 3.3 V
Surface Mount YES YES
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED INDUSTRIAL
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED NOT SPECIFIED
Width 5.5 mm 3.9 mm
Base Number Matches 2 1
Additional Feature 3 ENABLE INPUTS
Load Capacitance (CL) 50 pF
Supply Voltage-Max (Vsup) 3.6 V
Supply Voltage-Min (Vsup) 2 V

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