HD74LS248FP-EL
vs
TC74LVQ138FNEL
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Rohs Code
Yes
No
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
RENESAS ELECTRONICS CORP
TOSHIBA CORP
Part Package Code
SOIC
SOIC
Package Description
SOP,
SOP,
Pin Count
16
16
Reach Compliance Code
unknown
unknown
Family
LS
LVQ
Input Conditioning
STANDARD
JESD-30 Code
R-PDSO-G16
R-PDSO-G16
Length
10.06 mm
9.9 mm
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
75 °C
85 °C
Operating Temperature-Min
-20 °C
-40 °C
Output Polarity
TRUE
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
SOP
SOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
SMALL OUTLINE
Peak Reflow Temperature (Cel)
260
240
Propagation Delay (tpd)
100 ns
15 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
1.75 mm
Supply Voltage-Nom (Vsup)
5 V
3.3 V
Surface Mount
YES
YES
Technology
TTL
CMOS
Temperature Grade
COMMERCIAL EXTENDED
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
1.27 mm
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
5.5 mm
3.9 mm
Base Number Matches
2
1
Additional Feature
3 ENABLE INPUTS
Load Capacitance (CL)
50 pF
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
2 V
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