HD74LS20FPEL vs 54LS30FMQB feature comparison

HD74LS20FPEL Renesas Electronics Corporation

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54LS30FMQB Fairchild Semiconductor Corporation

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP FAIRCHILD SEMICONDUCTOR CORP
Part Package Code SOIC DFP
Package Description SOP, SOP14,.3 CERAMIC, FP-14
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-PDSO-G14 R-GDFP-F14
Length 10.06 mm
Load Capacitance (CL) 15 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.008 A 0.004 A
Moisture Sensitivity Level 1
Number of Functions 2 1
Number of Inputs 4 8
Number of Terminals 14 14
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -20 °C -55 °C
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DFP
Package Equivalence Code SOP14,.3 FL14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE FLATPACK
Packing Method TR
Peak Reflow Temperature (Cel) 260
Power Supply Current-Max (ICC) 2.2 mA 1.1 mA
Prop. Delay@Nom-Sup 15 ns 20 ns
Propagation Delay (tpd) 15 ns 20 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 2.2 mm 2.032 mm
Supply Voltage-Max (Vsup) 5.25 V 5.5 V
Supply Voltage-Min (Vsup) 4.75 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES YES
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Form GULL WING FLAT
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 20
Width 5.5 mm 6.2865 mm
Base Number Matches 3 1
JESD-609 Code e0
Screening Level MIL-STD-883 Class B
Terminal Finish TIN LEAD

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