HD74LS175P-E
vs
SN74LS175ND
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MOTOROLA SEMICONDUCTOR PRODUCTS
|
| Part Package Code |
DIP
|
|
| Package Description |
DIP, DIP16,.3
|
DIP, DIP16,.3
|
| Pin Count |
16
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Family |
LS
|
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
| JESD-609 Code |
e4
|
e0
|
| Length |
19.2 mm
|
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
30000000 Hz
|
30000000 Hz
|
| Max I(ol) |
0.008 A
|
0.008 A
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
4
|
|
| Number of Functions |
1
|
4
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
75 °C
|
70 °C
|
| Operating Temperature-Min |
-20 °C
|
|
| Output Polarity |
COMPLEMENTARY
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP16,.3
|
DIP16,.3
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
18 mA
|
18 mA
|
| Propagation Delay (tpd) |
30 ns
|
|
| Qualification Status |
Not Qualified
|
|
| Seated Height-Max |
5.06 mm
|
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
COMMERCIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
Tin/Lead (Sn/Pb)
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
7.62 mm
|
|
| fmax-Min |
30 MHz
|
|
| Base Number Matches |
1
|
3
|
| Power Supplies |
|
5 V
|
|
|
|
Compare HD74LS175P-E with alternatives