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HD74LS174P vs 74HC173DB,118 feature comparison

HD74LS174P Hitachi Ltd

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74HC173DB,118 NXP Semiconductors

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Rohs Code Yes Yes
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD NXP SEMICONDUCTORS
Part Package Code DIP SSOP1
Package Description DIP, DIP16,.3 SSOP,
Pin Count 16 16
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS HC/UH
JESD-30 Code R-PDIP-T16 R-PDSO-G16
Length 19.2 mm 6.2 mm
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 30000000 Hz
Max I(ol) 0.008 A
Number of Bits 6 4
Number of Functions 1 1
Number of Terminals 16 16
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -20 °C -40 °C
Output Polarity TRUE TRUE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SSOP
Package Equivalence Code DIP16,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE, SHRINK PITCH
Power Supply Current-Max (ICC) 26 mA
Propagation Delay (tpd) 30 ns 53 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm 2 mm
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO YES
Technology TTL CMOS
Temperature Grade COMMERCIAL EXTENDED AUTOMOTIVE
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 0.65 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 5.3 mm
fmax-Min 30 MHz 60 MHz
Base Number Matches 1 1
Manufacturer Package Code SOT338-1
Additional Feature WITH HOLD MODE
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Moisture Sensitivity Level 1
Output Characteristics 3-STATE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage-Max (Vsup) 6 V
Supply Voltage-Min (Vsup) 2 V
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Logic » FF/Latches
Logic » FF/Latches

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Compare 74HC173DB,118 with alternatives