HD74LS156P-E
vs
SN54LS156N
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
MOTOROLA INC
|
| Part Package Code |
DIP
|
DIP
|
| Package Description |
DIP, DIP14,.3
|
DIP,
|
| Pin Count |
16
|
16
|
| Reach Compliance Code |
compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
LS
|
LS
|
| Input Conditioning |
STANDARD
|
STANDARD
|
| JESD-30 Code |
R-PDIP-T16
|
R-PDIP-T16
|
| Length |
19.2 mm
|
19.175 mm
|
| Load Capacitance (CL) |
15 pF
|
|
| Logic IC Type |
2-LINE TO 4-LINE DECODER
|
2-LINE TO 4-LINE DECODER
|
| Max I(ol) |
0.008 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
75 °C
|
125 °C
|
| Operating Temperature-Min |
-20 °C
|
-55 °C
|
| Output Characteristics |
OPEN-COLLECTOR
|
OPEN-COLLECTOR
|
| Output Polarity |
INVERTED
|
INVERTED
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Power Supply Current-Max (ICC) |
10 mA
|
|
| Prop. Delay@Nom-Sup |
51 ns
|
|
| Propagation Delay (tpd) |
51 ns
|
51 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.06 mm
|
4.44 mm
|
| Supply Voltage-Max (Vsup) |
5.25 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.75 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
TTL
|
TTL
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Width |
7.62 mm
|
7.62 mm
|
| Base Number Matches |
1
|
2
|
| Additional Feature |
|
USABLE AS 1 TO 8 DEMULTIPLEXER
|
|
|
|
Compare HD74LS156P-E with alternatives
Compare SN54LS156N with alternatives