HD74LS148FPEL
vs
7604301FX
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MOTOROLA INC
Part Package Code
SOIC
Package Description
SOP, SOP16,.3
DFP,
Pin Count
16
Reach Compliance Code
compliant
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-PDSO-G16
R-GDFP-F16
Length
10.06 mm
Logic IC Type
ENCODER
ADDER/SUBTRACTOR
Moisture Sensitivity Level
1
Number of Bits
8
4
Number of Functions
1
1
Number of Terminals
16
16
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-20 °C
-55 °C
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DFP
Package Equivalence Code
SOP16,.3
FL16,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
FLATPACK
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
36 ns
41 ns
Qualification Status
Not Qualified
Seated Height-Max
2.2 mm
Supply Voltage-Max (Vsup)
5.25 V
5.5 V
Supply Voltage-Min (Vsup)
4.75 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Form
GULL WING
FLAT
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Time@Peak Reflow Temperature-Max (s)
20
Width
5.5 mm
Base Number Matches
1
4
Screening Level
MIL-STD-883
Compare HD74LS148FPEL with alternatives
Compare 7604301FX with alternatives