HD74LS125AP
vs
SN74LS125AJD
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
HITACHI LTD
MOTOROLA SEMICONDUCTOR PRODUCTS
Part Package Code
DIP
Package Description
DIP, DIP14,.3
DIP, DIP14,.3
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
Control Type
ENABLE LOW
ENABLE LOW
Family
LS
LS
JESD-30 Code
R-PDIP-T14
R-XDIP-T14
Length
19.2 mm
19.495 mm
Load Capacitance (CL)
45 pF
Logic IC Type
BUS DRIVER
BUS DRIVER
Max I(ol)
0.024 A
0.024 A
Number of Bits
1
4
Number of Functions
4
1
Number of Ports
2
2
Number of Terminals
14
14
Operating Temperature-Max
75 °C
70 °C
Operating Temperature-Min
-20 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
CERAMIC
Package Code
DIP
DIP
Package Equivalence Code
DIP14,.3
DIP14,.3
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
IN-LINE
IN-LINE
Power Supply Current-Max (ICC)
20 mA
Prop. Delay@Nom-Sup
18 ns
Propagation Delay (tpd)
18 ns
18 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
5.06 mm
5.08 mm
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
COMMERCIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Pitch
2.54 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
7.62 mm
7.62 mm
Base Number Matches
2
3
JESD-609 Code
e0
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Power Supplies
5 V
Supply Voltage-Max (Vsup)
5.25 V
Supply Voltage-Min (Vsup)
4.75 V
Terminal Finish
Tin/Lead (Sn/Pb)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare HD74LS125AP with alternatives
Compare SN74LS125AJD with alternatives