HD74LS113RP-EL
vs
M38510/30104BAX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
RENESAS ELECTRONICS CORP
TELEDYNE E2V (UK) LTD
Part Package Code
SOIC
DFP
Package Description
SOP,
DFP,
Pin Count
14
14
Reach Compliance Code
compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
LS
LS
JESD-30 Code
R-PDSO-G14
R-GDFP-F14
Length
8.65 mm
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Number of Bits
2
2
Number of Functions
2
2
Number of Terminals
14
14
Operating Temperature-Max
75 °C
125 °C
Operating Temperature-Min
-20 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
CERAMIC, GLASS-SEALED
Package Code
SOP
DFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE
FLATPACK
Propagation Delay (tpd)
30 ns
42 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
YES
Technology
TTL
TTL
Temperature Grade
COMMERCIAL EXTENDED
MILITARY
Terminal Form
GULL WING
FLAT
Terminal Pitch
1.27 mm
Terminal Position
DUAL
DUAL
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
Width
3.95 mm
fmax-Min
30 MHz
25 MHz
Base Number Matches
2
3
ECCN Code
EAR99
Supply Voltage-Max (Vsup)
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
Compare HD74LS113RP-EL with alternatives
Compare M38510/30104BAX with alternatives