HD74LS113FP-EL vs 5962-3830104BCX feature comparison

HD74LS113FP-EL Renesas Electronics Corporation

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5962-3830104BCX Motorola Mobility LLC

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Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP MOTOROLA INC
Part Package Code SOIC DIP
Package Description SOP, DIP,
Pin Count 14 14
Reach Compliance Code compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-PDSO-G14 R-GDIP-T14
Length 10.06 mm
Logic IC Type J-K FLIP-FLOP J-K FLIP-FLOP
Number of Bits 2 2
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 75 °C 125 °C
Operating Temperature-Min -20 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY CERAMIC, GLASS-SEALED
Package Code SOP DIP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE IN-LINE
Propagation Delay (tpd) 30 ns 42 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.2 mm
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount YES NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED MILITARY
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 1.27 mm
Terminal Position DUAL DUAL
Trigger Type NEGATIVE EDGE NEGATIVE EDGE
Width 5.5 mm
fmax-Min 30 MHz 25 MHz
Base Number Matches 2 3
Supply Voltage-Max (Vsup) 5.5 V
Supply Voltage-Min (Vsup) 4.5 V

Compare HD74LS113FP-EL with alternatives

Compare 5962-3830104BCX with alternatives