HD74LS00P vs SN74LS00NDS feature comparison

HD74LS00P Renesas Electronics Corporation

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SN74LS00NDS Motorola Mobility LLC

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Pbfree Code Yes
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer RENESAS ELECTRONICS CORP MOTOROLA INC
Part Package Code DIP DIP
Package Description DIP, DIP14,.3 DIP, DIP14,.3
Pin Count 14 14
Reach Compliance Code unknown unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family LS LS
JESD-30 Code R-PDIP-T14 R-PDIP-T14
Length 19.2 mm 18.86 mm
Load Capacitance (CL) 15 pF
Logic IC Type NAND GATE NAND GATE
Max I(ol) 0.008 A
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 75 °C 70 °C
Operating Temperature-Min -20 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP DIP
Package Equivalence Code DIP14,.3 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE IN-LINE
Peak Reflow Temperature (Cel) NOT SPECIFIED
Power Supply Current-Max (ICC) 4.4 mA
Prop. Delay@Nom-Sup 15 ns
Propagation Delay (tpd) 15 ns 15 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 5.06 mm 5.08 mm
Supply Voltage-Max (Vsup) 5.25 V 5.25 V
Supply Voltage-Min (Vsup) 4.75 V 4.75 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology TTL TTL
Temperature Grade COMMERCIAL EXTENDED COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Pitch 2.54 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 7.62 mm 7.62 mm
Base Number Matches 2 3
JESD-609 Code e0
Terminal Finish TIN LEAD

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