HD74HCT540T-EL
vs
TC74HCT533AP
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Active
Ihs Manufacturer
HITACHI LTD
TOSHIBA CORP
Part Package Code
SOIC
DIP
Package Description
TSSOP,
DIP, DIP20,.3
Pin Count
20
20
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HCT
HCT
JESD-30 Code
R-PDSO-G20
R-PDIP-T20
Length
6.5 mm
24.6 mm
Logic IC Type
BUS DRIVER
BUS DRIVER
Number of Bits
8
8
Number of Functions
1
1
Number of Ports
2
2
Number of Terminals
20
20
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Output Polarity
INVERTED
INVERTED
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSSOP
DIP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
IN-LINE
Propagation Delay (tpd)
25 ns
48 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.1 mm
4.45 mm
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
YES
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
THROUGH-HOLE
Terminal Pitch
0.65 mm
2.54 mm
Terminal Position
DUAL
DUAL
Width
4.4 mm
7.62 mm
Base Number Matches
2
1
Pbfree Code
Rohs Code
Additional Feature
ENABLE TIME @ RL=1K
JESD-609 Code
e0
Load Capacitance (CL)
150 pF
Max I(ol)
0.006 A
Package Equivalence Code
DIP20,.3
Prop. Delay@Nom-Sup
38 ns
Terminal Finish
TIN LEAD
Compare HD74HCT540T-EL with alternatives
Compare TC74HCT533AP with alternatives