HD74HC86T-EL vs 74HC86PW,112 feature comparison

HD74HC86T-EL Hitachi Ltd

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74HC86PW,112 NXP Semiconductors

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Part Life Cycle Code Transferred Transferred
Ihs Manufacturer HITACHI LTD NXP SEMICONDUCTORS
Part Package Code SOIC TSSOP
Package Description TSSOP, TSSOP-14
Pin Count 14 14
Reach Compliance Code unknown compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC HC/UH
JESD-30 Code R-PDSO-G14 R-PDSO-G14
Length 5 mm 5 mm
Logic IC Type XOR GATE XOR GATE
Number of Functions 4 4
Number of Inputs 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP TSSOP
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Propagation Delay (tpd) 150 ns 180 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.1 mm 1.1 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL AUTOMOTIVE
Terminal Form GULL WING GULL WING
Terminal Pitch 0.65 mm 0.65 mm
Terminal Position DUAL DUAL
Width 4.4 mm 4.4 mm
Base Number Matches 2 2
Rohs Code Yes
Manufacturer Package Code SOT402-1
JESD-609 Code e4
Load Capacitance (CL) 50 pF
Max I(ol) 0.004 A
Moisture Sensitivity Level 1
Package Equivalence Code TSSOP14,.25
Packing Method TUBE
Peak Reflow Temperature (Cel) 260
Prop. Delay@Nom-Sup 36 ns
Schmitt Trigger NO
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au)
Time@Peak Reflow Temperature-Max (s) 30

Compare HD74HC86T-EL with alternatives

Compare 74HC86PW,112 with alternatives