HD74HC78RP
vs
M38510/30101B2A
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
RENESAS ELECTRONICS CORP
MOTOROLA INC
Part Package Code
SOIC
Package Description
SOP,
QCCN,
Pin Count
14
Reach Compliance Code
unknown
unknown
HTS Code
8542.39.00.01
8542.39.00.01
Family
HC/UH
LS
JESD-30 Code
R-PDSO-G14
S-XQCC-N20
Length
8.65 mm
Logic IC Type
J-K FLIP-FLOP
J-K FLIP-FLOP
Number of Bits
2
2
Number of Functions
1
2
Number of Terminals
14
20
Operating Temperature-Max
85 °C
125 °C
Operating Temperature-Min
-40 °C
-55 °C
Output Polarity
COMPLEMENTARY
COMPLEMENTARY
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
SOP
QCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
SMALL OUTLINE
CHIP CARRIER
Propagation Delay (tpd)
190 ns
42 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.75 mm
Supply Voltage-Max (Vsup)
6 V
5.5 V
Supply Voltage-Min (Vsup)
2 V
4.5 V
Supply Voltage-Nom (Vsup)
4.5 V
5 V
Surface Mount
YES
YES
Technology
CMOS
TTL
Temperature Grade
INDUSTRIAL
MILITARY
Terminal Form
GULL WING
NO LEAD
Terminal Pitch
1.27 mm
Terminal Position
DUAL
QUAD
Trigger Type
NEGATIVE EDGE
NEGATIVE EDGE
Width
3.95 mm
Base Number Matches
2
6
Package Equivalence Code
LCC20,.35SQ
Screening Level
MIL-M-38510 Class B
fmax-Min
25 MHz
Compare HD74HC78RP with alternatives
Compare M38510/30101B2A with alternatives