HD74HC77FPEL
vs
DM74ALS74ASJX
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
RENESAS ELECTRONICS CORP
|
NATIONAL SEMICONDUCTOR CORP
|
| Part Package Code |
SOIC
|
|
| Package Description |
SOP, SOP14,.3
|
EIAJ, PLASTIC, SOIC-14
|
| Pin Count |
14
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
|
| Family |
HC/UH
|
ALS
|
| JESD-30 Code |
R-PDSO-G14
|
R-PDSO-G14
|
| Length |
10.06 mm
|
10.11 mm
|
| Load Capacitance (CL) |
50 pF
|
50 pF
|
| Logic IC Type |
D LATCH
|
D FLIP-FLOP
|
| Max I(ol) |
0.004 A
|
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
2
|
1
|
| Number of Functions |
2
|
2
|
| Number of Terminals |
14
|
14
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Polarity |
TRUE
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
SOP
|
SOP
|
| Package Equivalence Code |
SOP14,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Prop. Delay@Nom-Sup |
26 ns
|
|
| Propagation Delay (tpd) |
130 ns
|
18 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
2.2 mm
|
2.108 mm
|
| Supply Voltage-Max (Vsup) |
6 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
2 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
4.5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
TTL
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
20
|
|
| Trigger Type |
HIGH LEVEL
|
POSITIVE EDGE
|
| Width |
5.5 mm
|
5.3 mm
|
| Base Number Matches |
1
|
3
|
| Power Supply Current-Max (ICC) |
|
4 mA
|
| fmax-Min |
|
34 MHz
|
|
|
|
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