HD74HC74P vs MC74HC74ADG feature comparison

HD74HC74P Renesas Electronics Corporation

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MC74HC74ADG onsemi

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Pbfree Code Yes Yes
Rohs Code Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer RENESAS ELECTRONICS CORP ONSEMI
Part Package Code DIP SOIC-14 NB
Package Description DIP, DIP14,.3 SOIC-14
Pin Count 14 14
Reach Compliance Code compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family HC/UH HC/UH
JESD-30 Code R-PDIP-T14 R-PDSO-G14
JESD-609 Code e4 e3
Length 19.2 mm 8.65 mm
Load Capacitance (CL) 50 pF 50 pF
Logic IC Type D FLIP-FLOP D FLIP-FLOP
Max Frequency@Nom-Sup 20000000 Hz 20000000 Hz
Max I(ol) 0.004 A 0.004 A
Number of Bits 1 1
Number of Functions 2 2
Number of Terminals 14 14
Operating Temperature-Max 85 °C 125 °C
Operating Temperature-Min -40 °C -55 °C
Output Polarity COMPLEMENTARY COMPLEMENTARY
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code DIP SOP
Package Equivalence Code DIP14,.3 SOP14,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE SMALL OUTLINE
Propagation Delay (tpd) 200 ns 150 ns
Qualification Status Not Qualified Not Qualified
Seated Height-Max 5.06 mm 1.75 mm
Supply Voltage-Max (Vsup) 6 V 6 V
Supply Voltage-Min (Vsup) 2 V 2 V
Supply Voltage-Nom (Vsup) 4.5 V 3 V
Surface Mount NO YES
Technology CMOS CMOS
Temperature Grade INDUSTRIAL MILITARY
Terminal Finish NICKEL PALLADIUM GOLD MATTE TIN
Terminal Form THROUGH-HOLE GULL WING
Terminal Pitch 2.54 mm 1.27 mm
Terminal Position DUAL DUAL
Trigger Type POSITIVE EDGE POSITIVE EDGE
Width 7.62 mm 3.9 mm
Base Number Matches 2 1
Manufacturer Package Code 751A-03
ECCN Code EAR99
Factory Lead Time 29 Weeks, 1 Day
Samacsys Manufacturer onsemi
Moisture Sensitivity Level 1
Packing Method RAIL
Peak Reflow Temperature (Cel) 260
Time@Peak Reflow Temperature-Max (s) 30
fmax-Min 24 MHz

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